Built on deep expertise in connectivity technologies, LinkedChip is expanding its portfolio from edge devices to AI data centers, delivering scalable solutions for the rapidly growing demands of AI infrastructure and applications.
Linkedchip's four-stage platform covers signal integrity at the chip-to-chip level through data center-scale network switching. Each product is built on the same unified SerDes and protocol technology core.
This coherent architecture creates compounding performance advantages — our products interoperate natively, reducing latency and power across the complete interconnect stack.
From 20Kbps to 200Gbps, 130nm to 4nm — proven mass-production expertise at every layer of the chip development process.
Founded in 2023, Linkedchip is headquartered in San Diego with R&D centers in Shanghai. Our team brings deep expertise across SerDes PHY, SoC design, PCIe/CXL protocol, and AI networking — with alumni from Qualcomm, Broadcom, AMD, Intel, and MediaTek.
Whether you're a customer, partner, or engineer — we'd like to hear from you.
Linkedchip works with hyperscalers, system OEMs, and ecosystem partners worldwide. We welcome inquiries from customers, technology collaborators, and potential partners.
