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Linkedchip Linkedchip Technology · AI Data Center Wireless & Sensing Platform
AI Data Center Server Infrastructure
AI Data Center Interconnect

Purpose-Built Connectivity
for Rack-Scale AI

Linkedchip delivers a unified SerDes and protocol architecture spanning PCIe/CXL signal integrity, compute fabric switching, SmartNICs, and Ethernet — the complete interconnect stack for next-generation AI infrastructure.

PCIe Gen5/6 CXL 2.0/3.0 224G PAM4 SerDes 51.2T Ethernet 800G Smart NIC 4nm Process
Product Portfolio

AI Data Center Interconnect

Linkedchip is building a full-stack AI Data Center Interconnect portfolio — spanning signal integrity, compute fabric, and network connectivity — purpose-built for the demands of rack-scale AI infrastructure.

The product family covers four interconnect layers: PCIe/CXL Retimer for signal conditioning, CXL Fabric Switch for intra-server compute pooling, Smart NIC for inter-server GPU cluster networking, and an AI-optimized Ethernet Switch for hyperscale fabric.

All products are currently in active development. We welcome early collaboration with AI infrastructure partners, hyperscalers, and system integrators.

Contact Us for Early Access
AI Data Center Interconnect
Linkedchip
The Platform

One Architecture.
Every Layer of the AI Data Center.

Linkedchip's four-stage platform covers signal integrity at the chip-to-chip level through data center-scale network switching. Each product is built on the same unified SerDes and protocol technology core.

This coherent architecture creates compounding performance advantages — our products interoperate natively, reducing latency and power across the complete interconnect stack.

GPU Server Infrastructure
Rack-Scale AI Infrastructure
Technology

Engineering Depth Across
the Full Semiconductor Stack

From 20Kbps to 200Gbps, 130nm to 4nm — proven mass-production expertise at every layer of the chip development process.

High-Speed SerDes
Full-stack PHY expertise from system to circuit level. 1.5G through 200Gbps PAM4 with mass-production silicon proven across multiple process nodes and form factors.
Advanced Process
130nm to N2 across standard CMOS, FinFET, and SOI. TSMC CoWoS, 2.5D/3D, and Chiplet packaging. Active UCIE consortium participants.
Mixed-Signal IP
PLL, AFE, ADC/DAC, and CDR IP for high-bandwidth wireline applications. PMIC and PMU IP for complete power management integration in SoC designs.
PCIe / CXL Protocol
Deep expertise in PCIe Gen5/Gen6 and CXL 2.0/3.0. Active Linux kernel CXL driver contributors. FPGA prototyping for hardware/software co-validation.
AI Network Architecture
Ethernet, PCIe 7, and UALink scale-out architectures. Deterministic latency and adaptive congestion management for distributed AI training and inference.
Software Ecosystem
PCIe/CXL Linux kernel drivers, API/SDK. SystemC and MATLAB dual-engine platform for architecture validation and BER / link budget analysis.
Early Access & Collaboration

Interested in Working With Us?

We welcome early collaboration with AI infrastructure partners, hyperscalers, and system integrators. Reach out to discuss co-development, partnership, or technical evaluation.

info@linkedchip.com Contact Form